har-modular C9-module male angled Pa1

Article No.: 02 51 909 1102

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Male connector

Article No.: 02 51 909 1102

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Male connector

Reflow soldering termination (THR), Wave soldering termination

Rated current: ‌2 A

Contacts: 9

Angled

Copper alloy

Noble metal over Ni Mating side, Sn over Ni Termination side

Performance level: 1, acc. to IEC 60603-2

Polyamide (PA)

Black

Identification

Version

Width of the module	10.16 mm
Termination method	Reflow soldering termination (THR)
Termination method	Wave soldering termination
Connection type	Motherboard to daughtercard
Number of contacts	9
Leading contact on position	a1
Termination length	3 mm

Technical characteristics

Contact spacing (mating side)	2.54 mm
Rated current	‌ 2 A
Clearance distance	‌1 mm in the module
‌1.9 mm to module edge
Creepage distance	‌1 mm in the module
‌1.8 mm to module edge
Insulation resistance	>10¹¹ Ω
Contact resistance	≤ 20 mΩ
Limiting temperature	-55 ... +125 °C (during reflow soldering max. +240 °C for 15 s)
Insertion force	≤ 9 N
Withdrawal force	≤ 6 N
Performance level	1
acc. to IEC 60603-2
Mating cycles	≥ 500
Test voltage U<sub>r.m.s.</sub>	1 kV
Isolation group	I (600 ≤ CTI)
Hot plugging	No
Moisture Sensitivity Level (MSL)	1 acc. to ECA/IPC/JEDEC J-STD-020D

Material properties

Material	Polyamide (PA)
Material (contacts)	Copper alloy
Surface (contacts)	Noble metal over Ni Mating side
Sn over Ni Termination side
Material flammability class acc. to UL 94	V-0
RoHS	compliant
ELV status	compliant
China RoHS	e
REACH Annex XVII substances	Not contained
REACH ANNEX XIV substances	Not contained
REACH SVHC substances	Not contained
California Proposition 65 substances	Not contained
Fire protection on railway vehicles	EN 45545-2 (2020-08)
Requirement set with Hazard Levels	R26

Specifications and approvals

Commercial data

Packaging size	20
Net weight	3.1 g
Country of origin	Romania
European customs tariff number	85366990
GTIN	5713140197909
ETIM	EC002637
eCl@ss	27460201 PCB connector (board connector)