har-flex HD-Card Edge 100p PL1 SAMPLE

Article No.: 15 04 100 2001 333

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New

Connector

Article No.: 15 04 100 2001 333

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Connector

Reflow soldering termination (SMT)

Contacts: 100

Copper alloy

Noble metal over Ni Mating side, Sn over Ni Termination side

Performance level: 1

Liquid crystal polymer (LCP)

Black

Identification

Version

Termination method	Reflow soldering termination (SMT)
Pack contents	Sample
Number of contacts	100
Connection type	Motherboard to daughtercard
Connection type	Mezzanine

Technical characteristics

Data rate	‌ 25 Gbit/s
Limiting temperature	-55 ... +125 °C
Mating cycles	≥ 200
Contact spacing (termination side)	0.8 mm
Contact spacing (mating side)	0.8 mm
Contact rows	2
Clearance distance	≥0.2 mm Backplane
	≥0.53 mm Connector
	≥0.1 mm Daughtercard
Creepage distance	≥0.2 mm Backplane
	≥0.53 mm Connector
	≥0.1 mm Daughtercard
Moisture Sensitivity Level (MSL)	1 acc. to ECA/IPC/JEDEC J-STD-020D
Process Sensitivity Level (PSL)	R0 acc. to ECA/IPC/JEDEC J-STD-020D
Coplanarity of contacts	≤ 0.13 mm
Isolation group	IIIa (175 ≤ CTI < 400)
Performance level	1
Insertion force	≤ 70 N
Withdrawal force	≥ 20 N

Material properties

Material (contacts)	Copper alloy
Surface (contacts)	Noble metal over Ni Mating side
Surface (contacts)	Sn over Ni Termination side
Material flammability class acc. to UL 94	V-0
Colour (insert)	Black
Material (insert)	Liquid crystal polymer (LCP)
RoHS	compliant
ELV status	compliant
China RoHS	e
REACH Annex XVII substances	Not contained
REACH ANNEX XIV substances	Not contained
REACH SVHC substances	Not contained
California Proposition 65 substances	Not contained

Commercial data

eCl@ss	27460201 PCB connector (board connector)
Packaging size	1
Country of origin	China
European customs tariff number	85366990
GTIN	5713140205444
ETIM	EC002637