har-flex ang m 12p PL1

Article No.: 15 15 012 2601 333

Image is for illustration purposes only. Please refer to product description.

Male connector

Article No.: 15 15 012 2601 333

to see prices and availability.

Male connector

Reflow soldering termination (SMT)

Contacts: 12

Angled

Copper alloy

Noble metal over Ni Mating side, Sn over Ni Termination side

Performance level: 1

Liquid crystal polymer (LCP)

Identification

Version

Termination method	Reflow soldering termination (SMT)
Connection type	Motherboard to daughtercard
	Extender card
	PCB to cable
Number of contacts	12
Pack contents	Sample

Technical characteristics

Contact rows	2
Contact spacing (termination side)	1.27 mm
Contact spacing (mating side)	1.27 mm
Clearance distance	≥ 0.4 mm
Creepage distance	≥ 0.4 mm
Insulation resistance	>10⁹ Ω
Contact resistance	< 25 mΩ
Limiting temperature	-55 ... +125 °C
Insertion force	≤ 9.6 N
Withdrawal force	≥ 1.8 N
≤ 8.4 N
Performance level	1
Mating cycles	≥ 500
Test voltage U<sub>r.m.s.</sub>	0.5 kV
Isolation group	IIIa (175 ≤ CTI < 400)

Material properties

Material (insert)	Liquid crystal polymer (LCP)
Material (contacts)	Copper alloy
Surface (contacts)	Noble metal over Ni Mating side
Sn over Ni Termination side
Material flammability class acc. to UL 94	V-0
RoHS	compliant
ELV status	compliant
China RoHS	e
REACH Annex XVII substances	Not contained
REACH ANNEX XIV substances	Not contained
REACH SVHC substances	Not contained
California Proposition 65 substances	Not contained

Specifications and approvals

UL / CSA	UL 1977 ECBT2.E102079
CSA-C22.2 No. 182.3 ECBT8.E102079

Commercial data

Packaging size	1
Net weight	0.6 g
Country of origin	China
European customs tariff number	85366990
GTIN	5713140117044
ETIM	EC002637
eCl@ss	27460201 PCB connector (board connector)