har-flex HD-Card Edge 100p PL1 SAMPLE

Article No.: 15 04 100 2001 333

New

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New

Connector

Article No.: 15 04 100 2001 333

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to see prices and availability.

Connector

Reflow soldering termination (SMT)

Contacts: 100

Copper alloy

Noble metal over Ni Mating side, Sn over Ni Termination side

Performance level: 1

Liquid crystal polymer (LCP)

Black

Identification

Version

Termination method	Reflow soldering termination (SMT)
Connection type	Motherboard to daughtercard
Connection type	Mezzanine
Number of contacts	100
Pack contents	Sample

Technical characteristics

Contact rows	2
Contact spacing (termination side)	0.8 mm
Contact spacing (mating side)	0.8 mm
Data rate	‌ 25 Gbit/s
Clearance distance	≥0.2 mm Backplane
	≥0.53 mm Connector
	≥0.1 mm Daughtercard
Creepage distance	≥0.2 mm Backplane
	≥0.53 mm Connector
	≥0.1 mm Daughtercard
Limiting temperature	-55 ... +125 °C
Insertion force	≤ 70 N
Withdrawal force	≥ 20 N
Performance level	1
Mating cycles	≥ 200
Isolation group	IIIa (175 ≤ CTI < 400)
Moisture Sensitivity Level (MSL)	1 acc. to ECA/IPC/JEDEC J-STD-020D
Process Sensitivity Level (PSL)	R0 acc. to ECA/IPC/JEDEC J-STD-020D
Coplanarity of contacts	≤ 0.13 mm

Material properties

Material (insert)	Liquid crystal polymer (LCP)
Colour (insert)	Black
Material (contacts)	Copper alloy
Surface (contacts)	Noble metal over Ni Mating side
Surface (contacts)	Sn over Ni Termination side
Material flammability class acc. to UL 94	V-0
RoHS	compliant
ELV status	compliant
China RoHS	e
REACH Annex XVII substances	Not contained
REACH ANNEX XIV substances	Not contained
REACH SVHC substances	Not contained
California Proposition 65 substances	Not contained

Commercial data

Packaging size	1
Country of origin	China
European customs tariff number	85366990
GTIN	5713140205444
ETIM	EC002637
eCl@ss	27460201 PCB connector (board connector)